UV+IR - Combinations
Double-chip photodiodes for simultaneous measurement of UV and IR
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SG01-TANDEM-XL
UVA+IR, active area UV chip = 7.60mm², active area InGaAs chip = 7.07mm², TO5 cap, for flame monitoring applications, other models can be produced, e.g. with a smaller SiC chip (1.82mm²) to save costs or with chips arranged next to each other instead of on top of each other. The advantage of this arrangement is a further further cost savings, the disadvantage is increased focusing effort. The IR sensor can be equipped with filters, e.g. to suppress visible radiation on the measured value.Product Description- Double-chip photodiodes for simultaneous measurement of UV and IR
- active area UV chip = 7.60mm²
- active area InGaAs chip = 7.07mm²
- TO5 housing hermetically encapsulated with 4 isolated pins
- further models can be produced, e.g. with a smaller SiC chip (1.82mm2) to save costs
- models available with chips arranged next to each other instead of on top of each other
- option of equipping the IR sensor with additional filters, e.g. to suppress visible radiation on the measured value